Faraday's Innovative Approach to 3D-IC Design Services

FREMONT, CA: Faraday Technology Corporation, a semiconductor industry leader, is expanding its use of Ansys (NASDAQ: ANSS) technology to improve its skills in generating innovative designs for multi-die 2.5D/3D-ICs, which are crucial for artificial intelligence (AI), IoT, and 5G applications. With Ansys' assistance, Faraday will enable its customers to explore more robust design possibilities for innovative products. 

Faraday, a major ASIC design service and IP provider assists customers with chip design initiatives. Faraday recently launched a 2.5D/3D-IC advanced package solution to meet the growing demand for multi-die designs that prioritize performance and power efficiency. To address this need, engineers require the appropriate multiphysics analysis techniques to ensure that chip designs have reliable signal and structural integrity and also reliable power distribution before they go to fabrication. The problem is exacerbated by the drive toward denser chips, which are more susceptible to EM difficulties.

"Our extensive silicon IP allows our customers to start designing from a solid foundation, enabling them to focus solely on innovation and differentiating themselves in the market," said C.H. Chien, vice president of R&D at Faraday. "Fabrication is exceptionally expensive and there is no room for error. So, keeping the overall project cost low is paramount, and it starts with the initial design. With the addition of RaptorX in this phase, we can offer customers an efficient workflow that includes design verification and signoff as well as access to top-tier test and fabrication services, removing doubts about the chip's performance and longevity."

Faraday's development process will become more precise and efficient when RaptorX is integrated into the design flow. Furthermore, it provides predictively accurate EM modeling and analysis for advanced 3D-IC products, ensuring that data transfer adheres to modern requirements. This will improve design accuracy, increase performance and reliability, and shorten time-to-market.